CBEC225 Series: Floating Board-to-Board Interconnects for Compact UAV Electronics

CBEC225 Series: Floating Board-to-Board Interconnects for Compact UAV Electronics

As drones continue to expand into applications such as aerial imaging, agricultural operations, logistics, inspection, and outdoor tasks, onboard electronic systems are evolving toward lighter weight, smaller form factors, and higher levels of integration.

The increasing integration of motors, flight control systems, sensors, power management, communication, and other functional modules places higher demands on the space utilization, mechanical reliability, and signal transmission performance of internal interconnect systems.

Internal Interconnection of Drone Electronic Modules

Internal Interconnection of Drone Electronic Modules

Drone electronics typically employ a variety of interconnection technologies, including board-to-board, wire-to-board, IDC, and FPC/FFC connections. Different interconnection solutions are selected according to module layouts and transmission requirements.

For critical electronic modules such as flight controllers, power management systems, and sensors, connectors must not only support reliable power and control signal transmission, but also maintain stable connections under continuous vibration, assembly tolerances, and complex electromagnetic environments.

Key Challenges of Internal Drone Interconnects

Due to limitations in overall size, weight, and module layout, drone electronic systems need to achieve high-density interconnection within a limited space.

At the same time, continuous vibration generated by motors and other components, together with temperature variations and complex electromagnetic environments encountered in outdoor operation, places higher demands on the mechanical and electrical performance of connectors.

For board-level interconnections in critical electronic modules, connectors need to address several key requirements:

  • Compact Layout: Enable high-density board-to-board connections within limited PCB space.
  • Assembly Tolerance Compensation: Accommodate positional deviations that may occur during module assembly.
  • Mechanical Reliability: Withstand continuous vibration and mechanical stress caused by repeated mating and unmating.
  • Signal Integrity: Support stable transmission of control and sensor signals.
  • Environmental Adaptability: Maintain reliable performance across varying temperatures and outdoor operating conditions.

Compact-Pitch Floating Board-to-Board Connection

To address the requirements for compact layouts and assembly tolerance compensation in critical drone modules, Greenconn CBEC225 Series board-to-board connectors feature a 1.27 mm pitch and support ±0.7 mm parallel floating compensation in the X/Y directions.

This floating capability enables high-density board-to-board interconnection within limited PCB space while providing a degree of tolerance for positional deviations during module assembly.

Under continuous vibration and demanding operating conditions, mechanical stability and electrical insulation are equally important. The CBEC225 Series has undergone relevant mechanical durability testing and provides stable insulation performance, supporting the long-term reliability requirements of drone electronic modules.

For modules such as flight control systems, power management boards, and sensor modules that require compact layouts, assembly tolerance compensation, and stable signal transmission, the CBEC225 Series provides a reliable board-to-board interconnection option.

CBEC225 Series 1.27 mm-Pitch Floating Board-to-Board Connector Selection

CBEC225 Series 1.27 mm-Pitch Floating Board-to-Board Connector Selection

Key Specifications of the CBEC225 Series

Rated Current1.7 A/Pin

Withstanding Voltage500 V AC/min

Insulation Resistance10,000 MΩ

Mechanical Durability500 cycles

Operating Temperature-55°C to +125°C

Transmission Speed8 Gbps

Designed for Critical Drone Electronic Modules

With its compact-pitch design, floating compensation capability, and stable electrical and mechanical performance, the CBEC225 Series can be used in a variety of board-level interconnection applications within drones, including:

  • Flight Control Mainboards
  • Power Management Boards
  • IMU Sensor Modules
  • Remote Control and Communication Modules

For drone electronic systems that require high-density board-to-board connections within limited space, while also accommodating assembly tolerances and maintaining mechanical reliability and signal transmission performance, the Greenconn floating connector series provides a flexible and reliable board-to-board interconnection solution.

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