Stamping Process of Board-to-Board Connectors

The stamping of board-to-board connectors refers to the process of using pressure and molds to stamp the pins or slots of the connector to the desired shape, in order to achieve precise connection between the connector and the circuit board. The manufacturing process of board-to-board connectors generally starts with stamping pins, the stamping process of board-to-board connectors includes several steps like material pre-treatment, film lamination, wiring, pressing, cutting, punching, and cleaning, etc.

Typically, the pins and slots of board-to-board connectors are stamped from metal strip materials and then processed into connector inserts. Traditional board-to-board connectors require multiple sets of molds for stamping during production, while modern automated equipment can manufacture them by setting different parameters and automatically adjusting the corresponding die head and mold tool.

In the stamping process of board-to-board connectors, the material also needs to be finely controlled and processed to ensure that the stamped connectors have suitable strength and conductivity. Quality testing is also required on the completed connectors to ensure product stability and safety.

Greenconn is an experienced manufacturer specializing in cable and connector manufacturing for years, owning a number of self-operated factories to provide global customers with fast and customizable one-stop production services. For more information, welcome to consult us!
TOP TOP
Contact Us
contact_support